Xiaomi is bringing a new flagship foldable phone to China on September 7, and the Xiaomi 18 Fold is shaping up to be more than a routine upgrade. The company has confirmed that the device will be its first flagship smartphone powered by the new XRING O3 chip, while also introducing a redesigned hinge, a 6,000mAh battery, and LPDDR6 memory on select configurations.
The XRING O3 is at the center of Xiaomi’s performance push. The chip features a 10-core all-big-core CPU paired with a 16-core G2-Ultra NX GPU. Xiaomi claims its laboratory testing produced an AnTuTu score of up to 5 million points under low-temperature conditions. As with other manufacturer benchmark figures, the result depends on the testing environment, so real-world performance may differ.
The Xiaomi 18 Fold will also use next-generation LPDDR6 memory, with supported versions reaching up to 113.8GB/s of memory bandwidth. That could be useful for demanding applications and workloads, particularly when paired with the new XRING O3 platform.
Xiaomi has fitted the foldable with a 6,000mAh Jinshajiang battery featuring 20% high-silicon content and an energy density of up to 920Wh/L. Charging support includes 67W wired charging and 50W wireless charging.
Xiaomi is also changing the mechanical design of the foldable. The 18 Fold uses a new-generation Dragon Bone Hinge with a three-stage linkage structure. The exterior combines Dragon Crystal Glass 3.0 on the front and rear with an aerospace-grade 7-series aluminum alloy mid-frame.
On the software side, the Xiaomi 18 Fold will run HyperOS 4 and introduce the new Super XiaoAI 2.0. Xiaomi is expected to provide more details about the software and AI features during the launch event.
The Xiaomi 18 Fold will officially launch in China on September 7, 2026. Pricing, memory configurations, availability, and other remaining specifications are expected to be announced at the event. For Xiaomi, the new foldable will serve as an early showcase for its XRING O3 platform and the company’s latest battery, hinge, and software technologies.
Xiaomi 18 Fold Specifications
| Specification | Xiaomi 18 Fold |
|---|---|
| Launch Date | September 7, 2026 |
| Market | China |
| Processor | Xiaomi XRING O3 |
| CPU | 10-core all-big-core CPU |
| GPU | 16-core G2-Ultra NX GPU |
| AnTuTu Score | Up to 5 million points* |
| Memory | LPDDR6, select versions |
| Memory Bandwidth | Up to 113.8GB/s |
| Battery | 6,000mAh Xiaomi Jinshajiang |
| Battery Technology | 20% high-silicon content |
| Energy Density | Up to 920Wh/L |
| Wired Charging | 67W |
| Wireless Charging | 50W |
| Hinge | New-generation Xiaomi Dragon Bone Hinge |
| Hinge Structure | Three-stage linkage design |
| Front Glass | Xiaomi Dragon Crystal Glass 3.0 |
| Rear Glass | Xiaomi Dragon Crystal Glass 3.0 |
| Frame | Aerospace-grade 7-series aluminum alloy |
| Operating System | Xiaomi HyperOS 4 |
| AI Assistant | Super XiaoAI 2.0 |
