At COMPUTEX 2025, TeamGroup unveiled two new CAMM2 memory modules under its T-FORCE lineup, highlighting advancements in memory performance and thermal design. The company presented the T-FORCE DELTA RGB CAMM2 and the T-FORCE VULCAN CAMM2, both equipped with distinct heat sink designs aimed at improving heat dissipation for high-density DRAM modules.
CAMM2, or Compression Attached Memory Module 2, has been gradually making its way into the mainstream memory market. Originally introduced in bare or sticker-based formats, CAMM2 has evolved to meet the demands of higher frequency and denser DRAM configurations. TeamGroup’s new modules reflect this shift by incorporating more robust thermal management features.
Both the DELTA RGB and VULCAN versions are rated at 32GB capacity, operating at 1.4V with speeds of 8000 MT/s and timings of CL42-50-50-84. The heat sink design on both modules uses a sandwich structure, allowing compatibility with both short (40mm) and long (64mm) CAMM2 form factors. The DELTA RGB features a glossy finish with integrated RGB lighting, while the VULCAN model opts for a more subdued matte surface, catering to users who prefer a minimalistic look.
The sandwich design aims to offer more effective heat dissipation compared to traditional bare modules. As CAMM2 memory continues to climb in frequency and density, effective thermal management is becoming increasingly critical. The dual-size support also signals TeamGroup’s intention to cater to various notebook and compact system layouts where space and airflow vary significantly.
In addition to CAMM2 products, TeamGroup also highlighted its high-speed CUDIMM (Compression UDIMM) modules at the show. The latest T-FORCE XTREEM CKD DDR5 module was demonstrated running at 10,266 MT/s, with a timing of CL48 at 1.5V, in a 2x24GB configuration. The modules have reportedly passed motherboard validation (MT passed), underlining stability at high speeds.
The CUDIMM platform is gaining attention for its improved power delivery and thermal efficiency over conventional DIMM designs. By optimizing the signal integrity and power routing, CUDIMM modules are positioned as a strong option for enthusiasts and professional users requiring top-tier performance.
TeamGroup COMPUTEX 2025 showcase reflects the growing importance of thermal design in next-generation memory products, especially as speeds continue to increase across both desktop and mobile platforms. With CAMM2 and CUDIMM both advancing rapidly, the company appears committed to pushing performance boundaries while addressing the real-world thermal challenges that come with it.
Source: UNIKO’s Hardware
