HOSINGLOBAL has introduced its new HG2325 UFS 2.2 embedded flash memory controller at COMPUTEX 2026, marking the company’s latest effort to expand its presence in the mobile and embedded storage segment. The controller is designed for smartphones, tablets, and compact computing devices, where efficiency, compatibility, and stable performance remain key requirements. Built on a 22nm process node, the HG2325 focuses on balancing power efficiency with mature manufacturing stability, making it suitable for large-scale deployment across consumer devices.
Inside the chip, HOSINGLOBAL integrates a high-capacity SRAM cache along with a self-developed 4KB LDPC hardware error correction engine. This combination is intended to improve data integrity and reduce error rates during sustained workloads. The controller supports both 3D TLC and QLC NAND flash types, allowing manufacturers flexibility when designing storage configurations across different price segments.
The HG2325 also supports flash interface speeds of up to 1600MT/s and is designed to work with major SoC platforms, including Qualcomm, MediaTek, and Unisoc. This broad compatibility makes it easier for OEMs to integrate the controller into existing mobile designs without major architectural changes. Storage capacities supported by the controller range from 64GB up to 1TB, covering entry-level devices as well as higher-capacity models.
For a 512GB configuration, HOSINGLOBAL reports sequential read speeds of up to 1060MB/s and write speeds reaching 975MB/s, aligning it with typical UFS 2.2 performance targets seen in current mobile devices.
Key specifications of the HG2325 include:
- Manufactured on a 22nm process node
- Built-in large-capacity SRAM cache
- 4KB LDPC hardware error correction engine
- Support for 3D TLC and QLC NAND flash
- Flash interface speeds up to 1600MT/s
- Compatibility with Qualcomm, MediaTek, and Unisoc platforms
- Storage capacities from 64GB to 1TB
- Up to 1060MB/s read and 975MB/s write (512GB configuration)
Alongside storage developments, COMPUTEX 2026 also featured additional industry showcases, including PCIe Gen5 x4 enterprise SSDs, DDR5-5600 RDIMM modules, and automotive-grade storage solutions, highlighting continued progress in both consumer and enterprise memory technologies.
The introduction of the HG2325 reflects ongoing demand for efficient UFS controllers that can support higher NAND densities while maintaining stable performance across a wide range of mobile devices and embedded systems.
