Maxsun Next-Gen Intel and AMD 800-Series Motherboards Leaked Ahead of Computex 2024

As the highly anticipated Computex 2024 approaches, motherboard enthusiasts have been given a sneak peek into the future of PC hardware thanks to recent submissions by Maxsun to the Eurasian Economic Commission (EEC). The Chinese hardware manufacturer has unveiled several next-generation Intel and possibly AMD 800-series motherboards, including the flagship Z890 series.

Maxsun’s comprehensive submissions list reveals a range of motherboards catering to various market segments, from high-end enthusiasts to budget-conscious consumers. This strategic move highlights the competitive landscape of the motherboard market, as both Intel and AMD prepare to launch their latest chipsets.

Intel 800-Series Motherboards

The Intel 800-series submissions by Maxsun include the Z890, B860, and H810 chipsets. These motherboards will be designed to accommodate Intel’s upcoming Arrow Lake-S “Core Ultra 200” desktop CPUs, utilizing the new LGA 1851 socket. This next-gen platform is expected to deliver significant performance improvements and new features aimed at both gamers and professional users.

The following models are part of Maxsun’s Intel 800-series lineup:

• MS-iCraft Z890 VERTEX
• MS-iCraft Z890 ARCTIC
• MS-iCraft Z890 PACIFIC
• MS-Terminator Z890-A
• MS-iCraft Z890ITX
• MS-ESPORT Z890M WIFI
• MS-Challenger Z890M WIFI

For the B860 chipset, Maxsun’s offerings include:

• MS-iCraft B860M CROSS
• MS-Terminator B860M
• MS-Terminator B860M GKD
• MS-ESPORT B860M SNIPER WIFI
• MS-ESPORT B860M GANK WIFI
• MS-ESPORT B860M ACE WIFI
• MS-Challenger B860M-E
• MS-Challenger B860M-F
• MS-Challenger B860M
• MS-MILESTONE B860M
• MS-Challenger B860ITX
• MS-Challenger B860BKB
• MS-Terminator B860YTX
• MS-Terminator B860ITX

For the entry-level H810 chipset, the following models are listed:

• MS-ESPORT H810M GANK WIFI
• MS-Challenger H810M
• MS-Challenger H810M-K
• MS-Challenger H810M-F
• MS-Challenger H810M-D

AMD 800-Series Motherboards

In addition to Intel, Maxsun’s EEC submissions also hint at AMD’s upcoming 800-series motherboards, specifically the B850 and B840 models. These are believed to be AMD’s follow-up to the current B650 series, designed to provide users with mid-tier performance options. The B850 and B840 motherboards are speculated to feature compatibility with Ryzen 7000, Ryzen 8000, Ryzen 9000, and future Zen architectures on the AM5 platform, ensuring longevity and upgradeability for AMD users.

Maxsun’s AMD 800-series submissions include:

• MS-Terminator B850M WIFI
• MS-Esports B850M WIFI6 ICE
• MS-Terminator B850ITX WIFI
• MS-Challenger B850M WIFI ICE
• MS-Challenger B840M 2.5G

Strategic Implications

The early reveal of these motherboards underscores Maxsun’s commitment to being at the forefront of PC hardware innovation. By offering a diverse range of motherboards that support both Intel’s and AMD’s latest processors, Maxsun is positioning itself as a versatile player capable of catering to the varied needs of consumers, from gamers seeking top-tier performance to professionals requiring reliable and scalable computing solutions.

As Computex 2024 draws near, the tech community eagerly anticipates more detailed announcements and hands-on demonstrations of these motherboards. The event promises to be a landmark showcase for the next generation of PC hardware, setting the stage for the innovations that will drive the industry forward in the coming years.

Conclusion

Maxsun’s submissions to the EEC provide a tantalizing glimpse into the future of motherboards. With next-gen Intel Z890, B860, and H810 models alongside AMD B850 and B840 offerings, consumers can look forward to a broad spectrum of options designed to meet their performance and budget needs. The upcoming Computex 2024 is set to be a pivotal moment for the unveiling of these cutting-edge technologies, promising exciting developments for PC enthusiasts worldwide.

Source: @harukaze5719, Wccftech