GIGABYTE showcased its latest motherboard technologies at CES 2026, focusing on maximizing the capabilities of AMD Ryzen 9000 Series processors with 3D V-Cache support. The highlight of the event is the introduction of X3D Turbo Mode 2.0, an adaptive performance tuning system designed to enhance CPU efficiency and response under varying workloads. The technology works in real-time to adjust processor performance, offering optimized operation for gaming, content creation, and professional applications.
At the top of the lineup is the X870E AORUS XTREME X3D AI TOP motherboard. This model supports DDR5 memory speeds exceeding 9000 MT/s, delivering higher memory bandwidth and stability for demanding applications. The motherboard’s cooling architecture includes the CPU Thermal Matrix, which lowers VRM and DDR temperatures by up to 8.5°C. Additionally, the DDR Wind Blade XTREME design reduces module temperatures by up to 9°C, while the M.2 Thermal Guard XTREME ensures that SSDs maintain consistent performance by lowering temperatures by up to 22°C. These features are aimed at sustaining high performance during extended workloads.
GIGABYTE also expanded its product lineup with a focus on design and usability. The X870E AERO X3D WOOD motherboard introduces a wood-grain finish combined with leather pull tabs, offering a more refined visual experience for PC builders seeking a natural aesthetic. Alongside this, the PROJECT STEALTH series was updated with sleek black motherboards, including the X870 and B850 AORUS STEALTH models. The reverse-connector layout simplifies cable management and enhances assembly efficiency, providing a cleaner appearance for custom builds.
These new offerings reflect GIGABYTE’s approach to combining performance, thermal management, and design. By integrating X3D Turbo Mode 2.0 and advanced cooling solutions, the company aims to deliver motherboards that meet the needs of both gamers and content creators. The updates to aesthetics and layout also address the growing interest in visually appealing and builder-friendly hardware.
For more details on GIGABYTE’s CES 2026 announcements, including the full lineup of X3D-powered motherboards and technologies, users can visit the GIGABYTE Event | CES 2026.
