COLORFUL Technology has expanded its AMD motherboard lineup with the launch of the iGame B850M ULTRA Series, introducing two new microATX models aimed at gamers, creators, and PC enthusiasts looking for compact yet performance-focused builds. The series includes the iGame B850M ULTRA-S and iGame B850M ULTRA-OC, both designed for AMD Ryzen desktop processors, including support for the latest Ryzen 9000 Series X3D CPUs.
Built around AMD’s next-generation platform, the new boards bring a mix of PCIe 5.0 support, high-speed DDR5 memory compatibility, and modern wireless connectivity, including Wi-Fi 7 and Bluetooth 5.4. COLORFUL is positioning the series as a balanced solution for gaming systems, productivity rigs, and overclocking-focused setups, all within a space-saving microATX layout.
A consistent design theme runs through both models, featuring an all-black aesthetic with matte-finish heatsinks and reinforced armor styling. The look is intended to match the company’s iGame GeForce RTX 50 Series ULTRA GPUs, targeting users building uniform, dark-themed PC setups without sacrificing hardware capability.
The iGame B850M ULTRA-S serves as the more balanced option in the lineup. It comes equipped with a 14+2+1 phase 80A DrMOS power delivery system and dual 8-pin CPU power connectors, designed to handle high-end Ryzen processors under sustained workloads. Memory support extends to four DDR5 DIMM slots with up to 256 GB capacity, supporting AMD EXPO profiles and speeds up to DDR5-8400 (OC).
Storage options on the ULTRA-S include three M.2 slots, with two PCIe 5.0 x4 and one PCIe 4.0 x4 interface, all paired with quick-release heatsinks for easier installation. Connectivity on the rear I/O includes USB 3.2 Gen 2×2 Type-C, multiple USB Type-A ports, HDMI, DisplayPort, 2.5 Gb Ethernet, and Wi-Fi 7 support. ARGB headers are also included for system lighting synchronization.
For users focused on performance tuning, the iGame B850M ULTRA-OC shifts the design toward memory overclocking and extreme performance stability. It features a 10+2+1 phase 60A DrMOS power design and supports flagship processors such as the Ryzen 9 9950X3D and Ryzen 7 9850X3D.
Unlike the ULTRA-S, the ULTRA-OC adopts a dual-DIMM memory configuration to improve signal quality and enhance overclocking headroom. It supports DDR5-8400 via AMD EXPO and can reach up to DDR5-8800 through manual tuning. Storage is expanded to four M.2 slots with a mix of PCIe 5.0 and PCIe 4.0 interfaces for high-capacity and high-speed SSD setups.
Networking also sees an upgrade, with 5 Gb Ethernet paired with Wi-Fi 7 and Bluetooth 5.4, making it more suitable for competitive gaming and high-bandwidth workloads. Combined with PCIe 5.0 graphics support and a full-featured rear I/O layout, the ULTRA-OC is aimed at enthusiasts pushing AMD’s latest platform to its limits.
