Longsys has introduced the industry’s first integrated-packaging micro SSD (mSSD), a new design that removes the need for the traditional printed circuit board (PCB) assembly process. The drive is built using wafer-level System-in-Package (SiP) technology, which combines multiple essential components—such as the controller, NAND flash memory, power management integrated circuit (PMIC), and passive parts—into a single compact package. This marks a major step toward simplifying solid-state drive manufacturing and improving product reliability across consumer and industrial applications.
According to Longsys, the use of SiP technology eliminates nearly 1,000 solder joints commonly present in standard PCB-based SSD designs. With fewer interconnects and solder points, the chance of manufacturing defects drops significantly, reducing the defect rate from ≤1000 DPPM to ≤100 DPPM. This improvement also enhances long-term stability and durability during heavy workloads and harsh operating conditions. Beyond the reliability gains, the new process removes several surface-mount technology (SMT) and reflow soldering steps, helping streamline production and shorten manufacturing time.
The company claims that this integration method lowers overall manufacturing costs by more than 10% and contributes to improved energy efficiency. Fewer processing steps also mean less energy consumption during production, aligning with ongoing efforts in the semiconductor industry to reduce environmental impact and carbon emissions.
Despite its compact footprint of 20 × 30 × 2.0 mm and light 2.2 g weight, the Longsys mSSD delivers high performance with PCIe Gen 4 ×4 connectivity. It achieves sequential read speeds of up to 7400 MB/s and sequential write speeds of up to 6500 MB/s. In random workloads, the drive reaches up to 1000K read and 820K write IOPS, providing strong performance for a range of storage applications.
To maintain performance consistency under load, the mSSD features an aluminium frame for structural stability, a graphene thermal pad, and thermal silicone material for heat dissipation. These elements work together to control temperature and ensure efficient heat management during extended operation. The drive supports both TLC and QLC NAND configurations and will be offered in capacities from 512 GB to 4 TB.
Longsys has also included a modular clip-on heatsink design that allows users and system builders to adapt the mSSD between M.2 2230, 2242, and 2280 form factors. This makes it suitable for a wide range of devices, including laptops, mini PCs, and embedded systems.
The company confirmed that the integrated-packaging micro SSD has entered mass production and that it has filed for related international patents to protect its design and manufacturing innovations. With the introduction of this product, Longsys aims to bring a new level of efficiency and compactness to the storage market while promoting greener, more cost-effective production methods.
