TeamGroup Inc. announced its participation in Embedded World 2026, scheduled to take place from March 10 to March 12 at the NürnbergMesse Convention Center in Nuremberg, Germany. Following its award recognition at last year’s event, the company is returning with a focus on edge computing, AI-driven deployments, and storage solutions designed for defense and other security-sensitive sectors.
At Hall 3 / Booth 3-349, TeamGroup will present its latest industrial-grade SSDs and memory modules developed for embedded systems, industrial automation, and high-performance computing. This year’s showcase centers on two themes, “Edge to Action” and “Military,” reflecting the company’s push into intelligent applications and secure data handling for mission-critical environments.
This SSD features a patented independent destruction circuit designed to handle both logical data erasure and physical NAND destruction. It is engineered with a power-loss continuation mechanism, allowing the destruction sequence to finish even if the host system unexpectedly powers off. The drive is positioned for defense applications, AI training systems, and other environments where strict data security and controlled data disposal are mandatory.
TeamGroup is also expanding its PCIe Gen 5 x4 industrial SSD lineup. The INDUSTRIAL R252 U.2 NVMe SSD delivers sequential read speeds of up to 14,000 MB/s and write speeds of up to 10,000 MB/s, positioning it for server and industrial workloads that process large volumes of data. For enterprise and AI applications, the INDUSTRIAL R253 EDSFF E3.S NVMe SSD offers high capacity and enhanced security features tailored for real-time analytics and critical infrastructure. The INDUSTRIAL R251 EDSFF E1.S NVMe SSD, designed for 1U servers, focuses on thermal efficiency and space optimization and carries MIL-STD vibration resistance certification for operation in demanding conditions.
In addition to storage, TeamGroup is introducing updates across its industrial memory portfolio. DDR4 U-DIMM and SO-DIMM modules are built for industrial control and IoT systems and use patented graphene-based heat dissipation technology to support stable performance in extreme temperatures. For higher-bandwidth environments, DDR5 CU-DIMM and CSO-DIMM modules reach speeds of up to 7200 MHz. R-DIMM variants incorporate registered buffering and ECC error correction to improve signal integrity and long-term reliability in data-intensive systems.
The company is also presenting its INDUSTRIAL LPDDR5X CAMM2 solution based on JEDEC standards. The module uses a low-profile compression connector and is designed for high-density platforms that require strong bandwidth and low latency while maintaining efficient thermal management.
TeamGroup Industrial is collaborating with IEI Integration Corp. at the event. At Hall 3 / 3-359, the companies will demonstrate integrated systems that combine TeamGroup’s industrial storage and memory with IEI’s edge AI computing platforms, including the GAIA Series Edge AI Servers. IEI will also showcase its MCS-DB001 maritime embedded platform at TeamGroup’s booth, configured with wide-temperature DDR5 memory and industrial SSD solutions aimed at maritime and transportation deployments.
With its return to Embedded World 2026, TeamGroup continues to expand its industrial storage and memory offerings for AI computing, edge infrastructure, defense, and other high-security applications. Visitors can explore the company’s full portfolio at Hall 3 / Booth 3-349 during the three-day exhibition in Nuremberg.
