Hyper, known for developing accessories and peripherals for creative professionals, announced that two of its latest products have received CES 2026 Innovation Awards. The announcement took place on November 5th in California. Among the award-winning products are the HyperSpace Trackpad Pro and the HyperDrive Next USB4 M.2 PCIe Enclosure, both designed to enhance productivity through advanced connectivity and durable design.
The HyperDrive Next USB4 M.2 PCIe Enclosure is based on Intel’s “Barlow Ridge” controller chip and supports USB4 version 2.0. It is also compatible with Thunderbolt 5 systems, allowing it to reach up to 80Gbps peer-to-peer bandwidth and deliver a maximum data transfer rate of 64Gbps. This performance enables users to experience fast read and write speeds when handling large media files or performing intensive data transfers.
This external enclosure supports M.2 storage devices in the 2280, 2260, 2242, and 2230 form factors. It is compatible with PCIe Gen4 and Gen3 NVMe SSDs and can also host compatible devices such as compact M.2-based AI accelerators or network cards. This versatility makes it suitable for professionals working in content creation, engineering, or research fields that require high-speed portable data access.
Durability and sustainability are key aspects of the product’s design. The HyperDrive Next enclosure features a chassis made entirely from recycled aluminum, which helps maintain structural strength while reducing environmental impact. It also carries IP55 certification, meaning it is protected against dust and water splashes, making it suitable for use in a variety of working environments. The enclosure supports tool-free installation, allowing users to easily insert or replace drives without additional equipment.
In terms of connectivity, the HyperDrive Next includes two USB-C ports—one for connecting to a host device and another for 20W Power Delivery input. This setup allows the enclosure to provide efficient power management and flexible usage options for different devices and systems. Hyper designed the enclosure to work seamlessly across platforms, ensuring compatibility with both macOS and Windows.
Hyper stated that the HyperDrive Next USB4 M.2 PCIe Enclosure will be available by the end of the fourth quarter of 2025. It is expected to retail for $199.99 in the United States. With its blend of high-speed data transfer, robust construction, and environmentally responsible materials, the HyperDrive Next represents a practical addition to the company’s growing lineup of professional-grade accessories.
The CES 2026 Innovation Award recognition reflects Hyper’s continued focus on developing reliable solutions for modern workflows, particularly in the areas of connectivity, data management, and portability. The company aims to expand its portfolio of USB4 and Thunderbolt-compatible products as adoption of these next-generation interfaces continues to grow.
