MediaTek Announces Dimensity 9400, Its First 3nm Second-Generation Chipset

MediaTek has officially introduced the Dimensity 9400, its first second-generation 3nm chipset. Built on the same cutting-edge architecture from TSMC as Apple’s M4, A18, and A18 Pro, the Dimensity 9400 promises notable advancements in performance, energy efficiency, and processing capabilities over its predecessor, the Dimensity 9300. This latest release marks another step forward in mobile processing power and comes with a range of upgraded features and specifications.

All-Performance Core Configuration

The Dimensity 9400 continues MediaTek’s approach of using an ‘all-performance core’ design, similar to the previous Dimensity 9300 and 9300+ models. This setup forgoes efficiency cores in favor of maximizing raw performance. The CPU cluster comprises one high-powered Cortex-X925 core clocked at 3.63GHz, three Cortex-X4 cores, and four Cortex-A720 cores, forming a ‘1 + 3 + 4’ configuration. In addition, the Dimensity 9400 includes 12MB of L3 cache and 10MB of system-level cache (SLC), further enhancing the chip’s processing capabilities.

GPU and Performance Gains

In terms of graphical performance, the Dimensity 9400 comes equipped with a new 12-core ARM Immortalis-G925 GPU, which is said to deliver significant improvements over its predecessor. According to MediaTek, peak GPU performance is 41% faster, with ray tracing capabilities seeing a 40% increase compared to the Dimensity 9300. This makes the new chipset particularly well-suited for graphically demanding tasks, such as mobile gaming and augmented reality (AR) applications.

When it comes to CPU performance, MediaTek claims that the Dimensity 9400 offers a 35% improvement in single-core performance and a 28% boost in multi-core performance compared to the previous generation. Although the new SoC does not adopt LPDDR5T RAM, it uses LPDDR5X memory, which operates at a faster 10.7GB/s bandwidth, ensuring faster data transfer and overall system responsiveness.

Advanced AI Capabilities

The Dimensity 9400 introduces MediaTek’s latest AI Agentic Engine, which comes with a more efficient Neural Processing Unit (NPU). This NPU is designed to handle tasks such as machine learning and generative model-based processes. According to MediaTek, the NPU is 35% more power efficient and delivers up to 80% faster performance in Large Language Model (LLM) prompt processing, which is increasingly important in modern smartphone applications.

Camera and Connectivity Features

On the imaging front, the Dimensity 9400 can support a single camera sensor up to 320MP, enabling high-resolution photography. It also supports 8K video recording at 60 frames per second (FPS), allowing users to capture videos with remarkable detail. The chipset’s camera capabilities are expected to appeal to mobile photography enthusiasts and content creators who seek higher resolution and video frame rates in their devices.

For wireless connectivity, the Dimensity 9400 features an updated suite of options, including support for Wi-Fi 7 and Bluetooth 5.4. These standards ensure faster, more reliable connections, catering to users who require high-speed wireless data transmission. The chipset’s 5G modem is capable of achieving downlink speeds of up to 7GB/s, promising faster internet connections and smoother streaming experiences.

Expected Launch and Pricing

MediaTek has stated that the Dimensity 9400 will become available in the fourth quarter of this year. Vivo is expected to be among the first smartphone manufacturers to release devices powered by the new 3nm chipset. While pricing for these devices is yet to be officially confirmed, earlier leaks suggest that Vivo’s most affordable Dimensity 9400-powered flagship could start at approximately $570, indicating that the new chipset may be relatively cost-effective despite its high-end features.

The Dimensity 9400 represents a major leap forward for MediaTek in the mobile processor space, positioning it to compete with other high-end chipsets in the market. As more information becomes available regarding the release of devices featuring this new chipset, further details about pricing and availability are expected to follow.

Stay tuned for more updates as additional information is revealed.

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