GIGABYTE has announced its new flagship motherboard, the X870E AORUS XTREME X3D AI TOP, developed specifically for AMD Ryzen X3D processors. The motherboard made its first appearance during GIGABYTE EVENT 2025 and introduced several platform-level improvements for users who require high performance and efficiency. Featuring X3D Turbo Mode 2.0, the system automatically adjusts power, thermal, and frequency parameters for each processor, allowing optimal tuning without manual configuration. According to GIGABYTE, this function can deliver up to 25 percent higher gaming performance and 14 percent improved multitasking efficiency compared to standard operation.
The X870E AORUS XTREME X3D AI TOP supports AMD Ryzen 9000, 8000, and 7000 series CPUs, offering full compatibility for current and upcoming desktop processors. It is built around a 24+2+2 phase (SPS 110A) VRM design that provides stable power delivery to handle demanding tasks. To maintain consistent performance, the board includes a new CPU Thermal Matrix and DDR Wind Blade XTREME, which work together to distribute heat evenly and improve cooling efficiency across the VRM and memory areas. Additional components, such as the M.2 Thermal Guard XTREME with a built-in fan and large aluminum heatsinks, further enhance temperature control under sustained workloads.
Memory overclocking receives attention through the D5 Bionic Corsa system, allowing DDR5 memory speeds to exceed 9000 MT/s with reliable stability. The feature automates fine-tuning for consistent results without the need for extensive testing. GIGABYTE also introduces DriverBIOS, an integrated system that includes Wi-Fi drivers directly in the BIOS, enabling wireless connectivity during initial setup. The motherboard’s 64 MB BIOS capacity supports more complex firmware and future updates.
Designed with builders in mind, the board includes several EZ-DIY tools such as PCIe EZ-Latch Plus Duo, M.2 EZ-Latch Click, and an EZ-Debug Zone that simplify installation and maintenance. For connectivity, the motherboard offers PCIe Gen 5 x16 and Gen 5 M.2 slots, ensuring compatibility with next-generation graphics cards and SSDs. Networking options include Dual 10G LAN and Wi-Fi 7 (320 MHz), accompanied by GIGABYTE’s upgraded ARGB directional antenna for stronger signal performance.
With the launch of the X870E AORUS XTREME X3D AI TOP, GIGABYTE expands its premium lineup, combining advanced features with long-term reliability. The new model focuses on delivering improved performance, efficient cooling, and enhanced user accessibility for gaming and professional use.
GIGABYTE X870E AORUS XTREME X3D AI TOP – Specifications
| Category | Details |
|---|---|
| Chipset | AMD X870E |
| CPU Support | AMD Ryzen 9000 / 8000 / 7000 Series (AM5 Socket) |
| Memory Support | DDR5, up to 192GB (4x DIMM), speeds up to 9000+ MT/s |
| Memory Features | D5 Bionic Corsa AI Overclocking, Dual Channel, ECC/Non-ECC support |
| Power Design | 24+2+2 Phase Digital VRM (SPS 110A) |
| X3D Turbo Mode | Version 2.0 – AI-Optimized Per-Chip Overclocking |
| Storage Interface | 5x M.2 Slots (PCIe 5.0/4.0), 6x SATA 6Gb/s Ports |
| Cooling Solutions | CPU Thermal Matrix, DDR Wind Blade XTREME, M.2 Thermal Guard XTREME (with 5mm fan), Large Fins Array Heatsink |
| Expansion Slots | 2x PCIe 5.0 x16, 1x PCIe 4.0 x4 |
| Networking | Dual 10G LAN, Wi-Fi 7 (320 MHz) with ARGB High-Gain Antenna |
| USB Connectivity | 2x USB 4.0, 6x USB 3.2 Gen 2, 8x USB 2.0 |
| Audio | ESS SABRE Hi-Fi Audio DAC, AMP-UP Audio Technology |
| Internal Features | EZ-DIY Suite (PCIe EZ-Latch Plus Duo, M.2 EZ-Latch Click, EZ-Debug Zone, Wi-Fi EZ-Plug) |
| BIOS | 64 MB Capacity, DriverBIOS (Built-in Wi-Fi Driver) |
| Form Factor | E-ATX |
| RGB Lighting | Multi-Zone RGB Fusion, ARGB Header Support |
| Power Connectors | 24-pin ATX, Dual 8-pin CPU Power |
| Special Features | DriverBIOS Wireless Setup, Thermal Matrix, Tool-Free Design, Reinforced PCIe & Memory Slots |
| Release Year | 2025 |
