FEVM Launches FA‑EX9 Mini PC Featuring AMD’s Strix Halo Processor

FEVM, a Chinese PC manufacturer, has released a new compact desktop system called the FA‑EX9. The mini PC is built around AMD’s latest Ryzen MAX+ 395 processor, also known as “Strix Halo,” and is designed for high-performance computing in a space-saving form factor.

The FA‑EX9 measures 192 × 190 × 55 mm and fits within a 2-liter chassis. It includes a 16-core processor based on AMD’s Zen 5 architecture and a built-in graphics solution with 40 compute units from the RDNA 3.5 generation. A separate processing unit is also included for handling specialized tasks, rated for up to 50 trillion operations per second. FEVM has tuned the processor to run at up to 120 watts of continuous power, placing it in the same performance category as some high-end laptop setups that combine top-tier CPUs with dedicated graphics cards.


For memory, the FA‑EX9 includes 128 GB of LPDDR5X running across a 256-bit interface. Of that total, up to 96 GB can be used by the built-in graphics, providing headroom for handling complex workloads. Storage options consist of two M.2 PCIe 4.0 slots, supporting up to 2 TB on a single drive and up to 16 TB total capacity when fully populated.

In terms of external connectivity, the system includes one HDMI 2.1 output, one DisplayPort 1.4, and two USB4 Type-C ports, allowing for support of up to four displays at 8K resolution. There is also an OCuLink interface, which provides the option to connect a desktop graphics card externally.

The FA‑EX9 appears to be designed with flexibility in mind, capable of supporting a range of use cases, including content creation, development workloads, and entertainment. Its design and feature set suggest that FEVM is positioning it as a compact workstation that can fit into small spaces without sacrificing capability.

This new system enters the market at a time when other manufacturers are also introducing high-performance mini PCs. For example, NVIDIA’s recently announced DGX Spark features its Grace Blackwell superchip and is built for performance in a small chassis. The Spark combines a 20-core processor with a new graphics engine and is optimized for complex computing tasks. It includes 128 GB of memory, up to 4 TB of storage, and network connectivity that supports 200 Gbps.

While both systems are compact, the FA‑EX9 provides more expandability and balanced general-purpose computing, whereas the DGX Spark is more focused on performance tuning and specific high-demand applications.

FEVM has not yet shared a release date or price for the FA‑EX9, but the hardware specifications suggest it is aimed at professionals who need strong computing power in a compact desktop. More information is expected to follow soon.

Sources: FEVN

Jani Dushman
Jani Dushman

I'm Jani, a dedicated Tech Writer and Reviewer at Xiaomitoday. With a passion for exploring and dissecting the latest in technology, my mission is to bring you insightful and comprehensive reviews that empower your decision-making in the fast-evolving world of gadgets and tech.

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